Story thread · 2 reports / 1 sources
Intel patent embeds MicroLEDs in chip packaging — technology may enable embedded optical interconnects through TGVs
tomshardware.com · 2h · first report
Intel has showcased a patent it filed in 2022 to embed MicroLEDs inside chip packaging. The company suggests this could be used for diagnostic testing, customized lighting on chip surfaces, but perhaps more importantly, an alternative integration for co-packaged optics
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