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Biwin Storage commits US$672M to double down on 2.5D packaging, compute-memory integration
digitimes.com · 21h · first report
Biwin Storage Technology plans to invest CNY4.5 billion (approx. US$672 million) in the third phase of its wafer-level advanced packaging and testing project, expanding 2.5D integration and compute-memory co-packaging capacity as AI and high-performance computing lift demand for advanced packaging.
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