Story thread · 2 reports / 1 sources
Intel reportedly in talks with AUO on advanced packaging
digitimes.com · 10h · first report
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Across 1 sources · syndicated copies counted once
Intel is reportedly in talks with AUO on Micro LED substrate-based advanced packaging for co-packaged optics (CPO) and high-density computing, as display makers look to turn large-area glass-processing expertise into semiconductor packaging capabilities.
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