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Weekly news roundup: AI boom strains chips; Google's TPUs pay off, China eyes 3nm without EUV

digitimes.com · 13h · first reportShare

This week’s reports centered on intensifying competition and bottlenecks across the semiconductor and AI supply chains, from Sandisk’s unusual engineering push in Korea and Google’s TPU-driven ASIC demand to equipment shortages and packaging debates that could slow capacity expansion. Taiwan’s Physical AI discussions emphasized system integration over components, while China’s semiconductor researchers outlined a DUV-based sub-3nm GAA path. Beijing also moved to restrict civilian drones starting in November sharply. Below are the most-read DIGITIMES stories from September 14 to September 20, 2026