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FSC teams with South Korean maker on TGV equipment for glass substrates

digitimes.com · 4h · first reportShare

Fu Chun Shin Machinery Manufacture (FSC), a major plastic injection molding machine maker, is expanding further into semiconductors by teaming up with Korean-Chinese joint venture Zhongke Xianfeng on through-glass via (TGV) equipment for glass substrates, used in next-generation advanced packaging. The two sides signed a cooperation agreement on September 14, initially targeting major printed circuit board (PCB), IC substrate, and OSAT makers in Taiwan and Southeast Asia.