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Chip Industry Technical Paper Roundup: Sept. 14

semiengineering.com · 1dShare

Heterogeneous memory chiplets for multi-request LLM inference; long-span ECC for HBM AI inference; quasi phase-only EUV masks; advanced packaging underfill cure and thermal-endurance modeling; HW information-flow tracking for pre-silicon security testing; charge characterization in TMD-based MOS structures. The post Chip Industry Technical Paper Roundup: Sept. 14 appeared first on Semiconductor Engineering .

First report: Heterogeneous Memory Chiplets Accelerate Multi-Request LLM Inference (NUS) — semiengineering.com, 3d