Story thread · 4 reports / 2 sources
Samsung Electro-Mechanics, LG Innotek vie in AI package substrates
digitimes.com · 4d
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Across 2 sources · syndicated copies counted once
At South Korea's recent KPCA Show 2026, Samsung Electro-Mechanics and LG Innotek showcased their next-generation package substrate technologies. As AI semiconductors evolve toward higher performance, increased density, and larger footprints, both companies are competing for dominance in this high-value-added advanced packaging market.
First report: LG Innotek tackles glass substrate microcrack issue as 2028 production race heats up — digitimes.com, 6d
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