Story thread · 3 reports / 2 sources

AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle

digitimes.com · 4dShare

Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical validation and supply-chain development. Key challenges include material brittleness and inconsistencies in through-glass via (TGV) metallisation processing and reliability.

First report: Spirox launches fast TGV crack inspection system — taipeitimes.com, 6d