Story thread · 3 reports / 1 sources
Exclusive Interview: WG Tech sees a faster route for TGV beyond displays
digitimes.com · 6d
WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV) substrates for optical communications and advanced packaging as AI demand expands.
First report: Corning targets AI bottlenecks with glass substrates, optics for high-speed data transmission — digitimes.com, 7d
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