Story thread · 6 reports / 3 sources

TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex

digitimes.com · 11dShare

TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while raising concerns over radiation exposure to sensitive memory devices.

First report: TSMC reportedly asks suppliers to develop 5μm HBM microbumps — digitimes.com, 13d