Story thread · 2 reports / 1 sources
Manz Asia says yield is key to glass core mass production
digitimes.com · 2h

As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies including FOPLP, CoPoS, and Glass Core. Manz Asia general manager Robert Lin said yield will determine whether Glass Core can move into mass production.
First report: Manz Asia targets PLP demand with three lines and three sizes — digitimes.com, 2d
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