Story thread · 3 reports / 2 sources

Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September

digitimes.com · 2hShare

Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea, after the project cleared a provincial urban-planning review. The move advances a broader capacity buildout to meet growing AI memory demand.

First report: HBM Shipments to Malaysia Surge, Pointing to Intel's "Project Pelican" Facility — techpowerup.com, 2d