Story thread · 2 reports / 1 sources
TSMC nears AI packaging demand after years of doubling capacity:'CoWoS guy' Jun He
digitimes.com · 19h · first report
TSMC has been roughly doubling its CoWoS and SoIC capacity annually for the past several years, and is running CoWoS at better than 98% yield — sometimes 99% — on multiple AI customer products already in high-volume manufacturing. By Jun He's account, that is finally almost enough.
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