Story thread · 2 reports / 1 sources

Analysis: TSMC expands Japan footprint with 3nm fab, advanced packaging push

digitimes.com · 4dShare

TSMC is expanding Japan's role in its global network as it prepares to add 3nm production in Kumamoto and deepens local capabilities in advanced packaging, chip design and next-generation image sensors.

First report: TSMC turns to OSATs for more CoW capacity as AI packaging bottleneck persists — digitimes.com, 5d