Story thread · 3 reports / 1 sources
Ajinomoto rides advanced packaging boom as ABF demand surges
digitimes.com · 2d
How the coverage leans
Across 1 sources · syndicated copies counted once
Ajinomoto raised its full-year forecast on August 6 as growing demand for AI servers and high-performance computing lifted sales of electronic materials used in semiconductor package substrates, highlighting how advanced packaging is shifting more value upstream into specialized materials.
First report: FOPLP leads production as CoPoS advances glass packaging — digitimes.com, 5d
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