Story thread · 5 reports / 4 sources
Hanwha Semitech expands packaging tools as TCB turns profitable
digitimes.com · 6d
How the coverage leans
Across 4 sources · syndicated copies counted once
South Korean semiconductor equipment maker Hanwha Semitech is expected to begin recognizing revenue from fan-out panel-level packaging (FOPLP) equipment starting in the third quarter of 2026. The move follows a return to profitability in the second quarter, driven by thermocompression bonding (TCB) tools. FOPLP is set to become the next growth engine as the company broadens its advanced packaging portfolio.
First report: Hanwha launches new holding firm under Kim Dong-seon — koreaherald.com, 8d
The coverage
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inquirer.com · 7d
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en.yna.co.kr · 8d
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