Story thread · 3 reports / 1 sources

Intel offers bonuses to speed up Ohio fab construction and reaches EMIB-T yields of 90%

digitimes.com · 8dShare

Intel is awarding bonuses for overtime work as it seeks to complete the construction of its Ohio fab complex by 2031. Meanwhile, the company has made progress on the development of its next-generation packaging technology, embedded multi-die interconnect bridge-through-silicon via (EMIB-T), positioning it to compete with TSMC.

First report: MediaTek eyes high-single-digit revenue growth, 20% ASIC share by 2027 — digitimes.com, 10d