Story thread · 3 reports / 3 sources

Thintronics wins proposed US CHIPS incentives for advanced substrate technology

digitimes.com · 10dShare

Thintronics, a semiconductor interconnect company, said in a press release on July 29 that it had signed a letter of intent with the US Department of Commerce and the CHIPS Research and Development Office for up to US$50 million in incentives under the CHIPS and Science Act.

First report: The Chips That Will Decide A.I.’s Future — nytimes.com, 13d