Story thread · 3 reports / 1 sources

Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging

digitimes.com · 11dShare

Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate etchants to include copper plating chemicals and chemical mechanical polishing (CMP) slurries, as the companies race to secure key materials for next-generation AI chip packaging.

First report: Huawei targets 2027 glass substrate production to gain an edge in AI chips — digitimes.com, 13d